Do you have an example of electromechanical coupling (bi-directional coupling between electrostatic field and forces and structural deformation) using the Multifield solver? In my application, voltage applied between the top and bottom surfaces of a hollow dielectric box produce structural deflection (much like that of a diaphram) in the top surface of the box.
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The attached presentation describes the model produced by the input file mdl12.inp. Electrostatic forces on applied to interior surfaces of the box across interface #1. Structural deformations are volumetrically interpolated onto electrostatic elements comprising the dielectric box through interface #2. |
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